Sodium Bisulphate Granules – Copper Plating Dry Acid – Copper Electroplating Component

Description

Electroplating-grade Sodium Bisulfate granules (dry acid/sodium hydrogen sulphate). This versatile chemical serves as a reliable, convenient solid alternative to handling liquid mineral acids, making it a workshop essential for metal finishing and bath maintenance.

• Copper Plating Bath Maintenance: Effectively used as an acid salt for preparing and maintaining copper plating solutions and adjusting bath chemistry.
• pH Reduction: Fast-dissolving granules  designed to reliably lower pH in various solutions. Warm water can be used to help dissolve them cleanly if needed.
• Safer Handling: Offers the acidification benefits of mineral acids without the extreme risks and fumes of handling concentrated liquids.