Matte Copper Brush Plating Solution

Description

JodeCraft™ Matte Copper Brush Plating Solution

Engineered for rapid metal deposition, high ionic conductivity, and exceptional deposit ductility, our High-Saturation Matte Copper Brush Plating Solution is formulated specifically for selective wand and brush plating setups. Containing a concentrated blend of 275 g/L high-purity copper sulfate, 200 g/L sodium bisulfate, 100 g/L citric acid, and 50 g/L trisodium citrate, this heavy-duty acidic chemistry delivers a smooth, low-stress matte copper deposit engineered for heavy build-up work, surface defect filling, and structural electroforming.

The dual sodium bisulfate and citrate buffering system ensures maximum bath stability, consistent conductivity, and low electrical resistance during manual wand application. By actively stripping light surface oxides while regulating pH, this high-saturation formula provides a dense, uniform undercoat over properly prepared copper, brass, bronze, and pre-struck metal substrates—making it the ideal foundation prior to nickel, silver, or decorative surface finishing.

Key Features & Technical Specs

• High Metal Saturation: Our Matte Copper Brush Plating Solution is formulated with 275 g/L copper sulfate to maximize copper ion density, enabling fast, thick layer build-up per pass.

• Low-Stress Matte Deposit: Produces a highly ductile, non-reflective copper coating that resists cracking or peeling under mechanical stress.

• Optimized for Wand Plating: Enhanced with sodium bisulfate and trisodium citrate to maintain stable conductivity and smooth swabbing action at 2.0 V to 4.5 V DC.

• Integrated Acid Activation: Citric acid buffer conditions the substrate surface during processing to maximize chemical bonding and eliminate adhesion failures.

• Versatile Workshop Uses: Our JodeCraft™ Matte Copper Brush Plating Solution is ideal for filling pitted components, localized engineering repairs, architectural antiquing, and heavy electroforming bases.