Alkaline Copper Strike plating Solution

Description

Alkaline Copper Strike plating Solution

Formulated specifically as a vital pre-treatment and adhesion layer, our Alkaline Copper Strike provides a fine-grained highly adherent foundation copper deposit. Designed to prepare difficult base metals-such as steel, iron, and zinc die castings-prior to applying subsequent decorative or heavy industrial plating layers, this non-cyanide strike bath prevents immersion-plating displacement and ensures superior bond strength.

Key features and benefits

• Superior adhesion: Formulated to create an unshakable metallurgical bond directly with challenging base metals, ensuring the subsequent electroplated layers will not blister, peel, or delaminate during thermal or mechanical stress.
• Excellent throwing power: Ensures a uniform, complete metallic coverage even across complex geometries, deep recesses, and difficult-to-plate substrate contours.
• Non-Cyanide Formulation: Engineered for safer handling and easier waste stream management without sacrificing the high performance strike adhesion required for active metals.
• Reliable base protection: Acts as a crucial barrier layer that prevents immersion plating or displacement reactions on reactive base metals such as steel, zinc or leaded alloys before subsequent heavy plating.
• Optimized Conductivity: Prepares the surface to accept secondary plating baths – such as acid copper or bright nickel – with minium electrical resistance and maximum bond integrity.