Formulated specifically as a vital pre-treatment and adhesion layer, our Alkaline Copper Strike Solution provides a fine-grained highly adherent foundation copper deposit. Designed to prepare difficult base metals-such as steel, iron, and zinc die castings-prior to applying subsequent decorative or heavy industrial plating layers, this non-cyanide strike bath prevents immersion-plating displacement and ensures superior bond strength.

Key features and benefits

Superior adhesion: Formulated to create an unshakable metallurgical bond directly with challenging base metals, ensuring the subsequent electroplated layers will not blister, peel, or delaminate during thermal or mechanical stress.
Excellent throwing power: Ensures a uniform, complete metallic coverage even across complex geometries, deep recesses, and difficult-to-plate substrate contours.
Non-Cyanide Formulation: Engineered for safer handling and easier waste stream management without sacrificing the high performance strike adhesion required for active metals.
Reliable base protection: Acts as a crucial barrier layer that prevents immersion plating or displacement reactions on reactive base metals such as steel, zinc or leaded alloys before subsequent heavy plating.
Optimized Conductivity: Prepares the surface to accept secondary plating baths – such as acid copper or bright nickel – with minium electrical resistance and maximum bond integrity.

electroplating chemicals

Boric Acid – Technical Grade – Electroplating Buffer

JodeCraft Professional Alkaline Copper Strike Electroplating Solution